Integrated Power Management: Devices, Circuits & Packaging. A dedicated forum for power-oriented microelectronics and cross-disciplinary innovation.
Microelectronics integration is essential. Conventional discrete power-electronics work without a direct integration contribution is out of scope.
IEEE affiliation & society sponsors
The IEEE IMPACT Conference focuses on power-oriented microelectronics, spanning integrated power devices, PMIC circuits, passive components and advanced packaging.
It targets innovations enabling higher integration, power density and efficiency through microelectronics technologies, heterogeneous integration and device–circuit–package co-design.
Outside scope: Contributions centered on conventional discrete power-electronics systems without a direct microelectronics-integration dimension are outside the primary scope. Please refrain from submitting such work.
Si, GaN, SiC and emerging power device technologies.
Integrated PMICs and innovative power-conversion circuits.
Passives, chiplets, thermal and heterogeneous integration.
IMPACT brings together experts working from the component to the package, and from circuit innovation to application requirements.
Application areas alone do not establish eligibility: each submission should clearly demonstrate a substantive contribution to microelectronics integration. Conventional discrete power-electronics systems without this connection are out of scope.
IMPACT is dedicated to integrated power devices, IC/PMIC circuits, integrated passives, microelectronic packaging and device–circuit–package co-design. Conventional, discrete or system-level power-electronics contributions without a direct and clear microelectronics-integration dimension are outside the scope. Please refrain from submitting such papers. Read the submission guidance →
Key milestones for the first edition of IEEE IMPACT in Kyoto.
Camera-ready submission, as specified in the current CfP.
Notification of acceptance to submitting authors.
IEEE IMPACT 2027 · Kyoto, Japan.
Download the preliminary Call for Papers for the 1st IEEE IMPACT Conference, Kyoto, Japan · June 19–20, 2027.
The document includes the scope, technical and application topics, submission guidelines, important dates and organizing committee.
One-page preliminary announcement · April 2, 2027 paper deadline · April 19, 2027 acceptance notification.
Leadership for the inaugural 2027 conference.
Makoto Takamiya
Gaël Pillonnet
Hanh-Phuc Le
Gaël Pillonnet
Hanh-Phuc Le
Makoto Takamiya
IEEE IMPACT 2027 takes place at the RIHGA Royal Hotel Kyoto in Kyoto, Japan, on June 19–20, 2027. It is co-located with the 2027 Symposium on VLSI Technology and Circuits, while remaining a separate conference.
RIHGA Royal Hotel Kyoto
19–20 June 2027
Further details on registration, the technical program and contacts will be announced as they are confirmed.
